Three Semiconductors Fabricating facilities unveiled worth over Rs 1 lakh crore

In line with this vision, the foundation stone is being laid for the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat along with the Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam, and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat. PM Modi participated in ‘India’s Techade: Chips for Viksit Bharat’ and laid the foundation stone of three semiconductor facilities worth about Rs 1.25 lakh crore on 13th March.

The Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up of Semiconductor Fabs in India. With a total investment of over Rs. 91,000 crores, this will be the first commercial semiconductor fab in the country.

 

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The Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with a total investment of about Rs 27,000 crore.

The Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, will be set up by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with a total investment of about Rs 7,500 crore.

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The semiconductor ecosystem will be strengthened through these facilities and will be fostered in India. These units will also employ thousands of youth in the semiconductor industry as well as catalyze employment generation in related sectors like electronics, telecom, etc.

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