Uttar Pradesh Govt to Sign MoU with IPEPCIL for Global Employment Opportunities
Mumbai: The Government of Uttar Pradesh organized Uttar Pradesh Industry Connect 2026 on March 13 in Mumbai in collaboration with FICCI.
The session brought together senior government officials and leading industrialists to discuss employment generation and skill development for the youth of the state.
Key Dignitaries Attended the Session
The event was attended by Shri Anil Rajbhar, Minister for Labour and Employment, Dr. M. K. Shanmuga Sundaram (IAS), Principal Secretary, Smt. Neha Prakash (IAS), Director, and Mr. Pramod Kumar Pundir, Additional Director.
They were joined by prominent industry representatives from across the country.
Focus on Skill Development and Global Mobility
The discussions focused on strengthening skill development initiatives, promoting international workforce mobility, and expanding employment opportunities in global markets.
The objective is to prepare youth in Uttar Pradesh for opportunities both within India and abroad by aligning training with industry requirements.
Proposed MoU with IPEPCIL
A key outcome of the session was a mutual agreement to move forward with a Memorandum of Understanding between the Labour and Employment Department and IPEPCIL.
The proposed MoU aims to create structured pathways for overseas employment, strengthen collaboration between government and industry, and enhance access to international job opportunities for skilled youth.
Strengthening Industry Partnerships
Officials emphasized the importance of partnerships with industry bodies to ensure that training programmes are aligned with global job market requirements. The initiative is expected to support the development of a workforce prepared for international employment.
Conclusion
Uttar Pradesh Industry Connect 2026 reflects the state’s focus on linking skill development with global employment opportunities. The proposed MoU with IPEPCIL is expected to contribute to expanding overseas career pathways for the youth of the state.
